GTJ 2025 Report (1/2): Grinding technology and SiC/GaN machining attract highly engaged visitors

Grinding Technology Japan (GTJ) 2025, a specialized exhibition focused on grinding technology, was held from March 5 to 7 at Makuhari Messe in Chiba City, Japan. The event attracted over 6,500 visitors over the three days and featured 172 exhibitors, including domestic and international manufacturers of grinding machines and peripherals, as well as research institutes. This fourth edition of the show was held alongside the SiC, GaN Machining Technology Exhibition 2025, a concurrent event focused on machining technologies for silicon carbide (SiC) and gallium nitride (GaN) power semiconductor wafers. The venue was filled with scenes of visitors engaged in detailed and enthusiastic discussions. 

Wide range of precision grinding technologies showcased

JTEKT’s cylindrical grinder “G3P100L” attracted considerable interest.

GTJ 2025 brought together a wide range of grinding-related technologies, including grinding machines, grinding wheels, and measurement systems. The concurrent SiC, GaN Machining Technology Exhibition 2025 focused on advanced machining technologies for SiC and GaN—materials that are attracting increasing attention as next-generation power semiconductor materials in the growing semiconductor industry. 

Okamoto Machine Tool Works, which also manufactures semiconductor production equipment, clearly targeted both events by exhibiting both grinding machines and semiconductor manufacturing systems. “Visitors from both the grinding and semiconductor sectors were surprised and impressed to see that we were offering solutions for both areas,” said a company representative. “It gave us valuable insights for future exhibition strategies.” 

JTEKT exhibited jointly with four group companies. Among its exhibits, the “G3P100L” cylindrical grinding machine, which is equipped with a handle that allows skilled operators to use it with the familiarity of general-purpose machines, attracted considerable attention. The company also dedicated a special section titled “Solving Labor Shortages Through New Technology,” which featured solutions such as visualizing grinding conditions using spark analysis. “Interest was much higher than we expected,” said a booth representative. 

Laser machining for hard and brittle materials also in focus

Sugino Machine highlighted its wide-ranging capabilities through diverse machining samples.

Makino Milling Machine participated in the SiC, GaN Machining Technology Exhibition 2025 by showcasing sample workpieces machined with its “Luminizer,” a water-guided laser machining system. The company emphasized its usefulness for machining SiC and GaN. 

Makino Milling Machine (Namerikawa City, Toyama, Japan) also displayed sample workpieces machined with its ultra-precision “WATERBEAM MACHINE,” which directs laser beams through a stream of water. The company also exhibited the vertical grinding machine “SELF-CENTER SC-V30aG,” as well as a special tool called “SUPEROLL,” which performs mirror finishing by pressing the surface instead of cutting or grinding. President Yoshiaki Sugino explained, “When people think about machining hard and brittle materials or achieving mirror finishes, they usually think of grinding. But we want to emphasize that other options exist. We’re here to show the breadth of our technologies.” 

To be continued in Part 2…