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EDM to slice next-generation semiconductor materials

November 15, 2019

Multi-wire-cut Electrical Discharge Machines


Mitsubishi Electric

DS1000 slices cylindrical configuration semiconducting materials into thin disk-shaped wafer.The DS1000 can machine simultaneously with multiple wires, producing up to 20 sheets at a time. This machine is compatible with next generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN).

The machining speed is improved by 60%, the yield is improved by 40%, and the running cost is reduced by 80% compared to slicing with a wire saw with diamond abrasive grains.

Source: SEISANZAI MARKETING Magazine October 2019 issue

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Mitsubishi Electric


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