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Epson and DBJ Invest in 3DEO

February 9, 2024

Seiko Epson (“Epson”) and Development Bank of Japan (“DBJ”) have invested in California-based 3DEO. 

3DEO is a North American startup with fully integrated services for the design and manufacturing of complex metal parts using its proprietary end-to-end 3D printing ecosystem of patented hardware and software. By partnering with customers on value-added design for additive manufacturing (DfAM) services, 3DEO accelerates production of innovative and competitive products in the aerospace, medical/healthcare, semiconductor and industrial markets. 

In recent years, manufacturing process improvement and product innovation using metal additive manufacturing (AM) have been expanding, especially in the fields of aerospace, medical/healthcare, and semiconductors. In addition, the automotive and industrial equipment sectors have begun to utilize the technology to reduce development costs and time, reduce weight, and produce spare parts and functional molds. 

On the other hand, in Japan, there is a strong belief in conventional metalworking based on precision casting, which has supported the growth of the machining and assembly industry, as well as the optimization of the supply chain in terms of quality and cost. Although there is a movement toward research and development of AM technologies and DfAM, the barriers to entry for implementation at production sites are high and, as a result, the supply chain is lagging far behind the trends of innovation. 

This investment is made by DBJ, which promotes “technological innovation and reorganization of industry,” and by Epson, which promotes “manufacturing innovation” under its Epson 25 Renewed Corporate Vision. The investment was made through the DBJ Startups and Innovation Fund, which is part of DBJ’s Specified Investment Operations, as it will support 3DEO’s business expansion in North America and Japan from a capital perspective and contribute to innovation and competitiveness enhancement in the Japanese manufacturing industry. 


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