IBIDEN invests 60 billion yen to increase the production capacity of IC package substrates

April 30, 2020

IBIDEN announced on April 27, 2020 that it will increase its IC package substrate production capacity at the Ogaki Central Plant. The investment amount is 60 billion yen. The operations will be started sequentially from the end of 2020 and mass production will be begun in FY21.

In November 2018, IBIDEN decided to make a capital investment of 70 billion yen in order to increase the production capacity of IC package substrates. The semiconductor market will be expected to grow due to digitalization, such as the expansion of the data sensor market due to the introduction of 5G and the mounting of image analysis technology in vehicles. Therefore, the company has decided to make an additional investment.